TEAMGROUP T-Force Dark Z 16GB Kit (2x8GB) DDR4 Dram 3200MHz (PC4-25600) CL16 288

Description

Armor design for perfect protection; Aluminum alloy heat sink with high performance; High thermal conductive adhesive
Supports Intel & AMD motherboards; Selected high-quality IC; Supports XMP2.0; Energy saving with ultra-low working voltage
3200MHz 16GB Kit (8GBx2) CL16-18-18-38; 25,600 MB/s (PC4 25600) 1.35V 288 Pin Unbuffered DIMM Non ECC
Dimensions: 43.5(H) x 141(L) x 8.3(W)mm
Lifetime warranty
Product Description
S
pecifications
Series:
DARK Z
Module Type:
288 Pin
Unbuffered DIMM Non ECC
Capacity:
16GB Kit (8GBx2)
Frequency:
3200MHz
Data Transfer Bandwidth:
25,600 MB/s (PC4 25600)
Dimensions: 43.5(H) x 141(L) x 8.3(W)mm
Latency:
CL16-18-18-38
Tested Voltage:
1.35V
Heat Spreader: Aluminum heat spreader
Disclaimers
Memory overclocking (OC) depends on the combination of the memory module and memory controller integrated into the CPU and motherboard.
The actual running speed of the memory module differs with different motherboard and CPU and settings.
Armor design, Metal logo
T-FORCE DARK Z DDR4 gaming memory is designed based on the concept of an armored knight. The sacred war robe offers a more complete protection. The simple yet brilliant line design of T-FORCE DARK Z DDR4 gaming memory refines the heat sink which made by traditional punch press process. Electrolytic anodizing process and metal electroforming logo design are used to echo with T-FORCE logo’s energetic tech armor.
Reinforced structure, Enhanced heat dissipation
T-FORCE DARK Z DDR4 gaming memory’s all new cooling module is designed with armor for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming overclocking memory can be maintained within operating temperature, and offering the finest and smoothest gaming experience and an extreme performance without any lag.
Selected IC chips, Stable and durable
Every IC chip made for TEAMGROUP’s T-FORCE DARK Z DDR4 gaming memory is selected through a rigorous testing process. Every overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
High performance, Low power consumption, Easy upgrade
In addition to the increase in data transfer rate, the basic working voltage of the new generation of upgraded DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.
Supports Intel XMP, Auto overclocking
T-FORCE DARK Z DDR4 gaming memory is plug and play ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible to both Intel & AMD platform, therefore gamers can build their system without worries.
Product Highlight
TEAMGROUP T-Force Dark Z DDR4 16GB Kit (2 x 8GB) 3200MHz CL16 SDRAM Desktop Gaming Memory Module Ram
Armor design for perfect protection
Aluminum alloy heat sink with high performance
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC
Supports XMP2.0
Energy saving with ultra-low working voltage
More about TEAMGROUP
Official website:
www.teamgroupinc.com/en
FB:
www.facebook.com/teamgroupinc
IG:
www.instagram.com/teamgroupinc
Twitter:
twitter.com/teamgroupinc
T-Force
THE POWER FROM TEAMGROUP
T-Force is Team Force, TF.
The RED T represents Team Group with its decades of accumulated passion and position in storage products, as well as the Black F is the Force of Team Group's combined knowledge and over 18 years of research and development in Storage Segment.
T-Force, TF, spread the Wings and Fly is the Logos schematization of TF.
FLY HIGH, FAST and STRONG with T-FORCE spirit
The simple message of the spreading spirit of TF wings, fly high and fast with the force in Team Group gaming products, fly strong with TF's spirit.
TEAMGROUP - MEMORY OF A LIFETIME
TEAMGROUP products have been well received by the technology media around the globe and have won honors such as
Computex D&I Awards
,
Best Choice Award
,
Good Design Product Award
,
Golden Pin design
、
TAIWAN EXCELLENCE
、
GOOD DESIGN AWARD 2017
、
reddot Design Award 2019
and
iF Design Award 2018 & 2019
. TEAMGROUP also listed company at stock exchange market in January,2019.
Series
DARK Z
DARK Z
DARK Z
DARK Z
DARK Z
DARK Z
Module Type
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
288 Pin Unbuffered DIMM Non ECC
Capacity
16GB Kit (8GBx2)
16GB Kit (8GBx2)
32GB Kit (16GBx2)
32GB Kit (16GBx2)
16GB Kit (8GBx2)
16GB Kit (8GBx2)
Frequency
3200MHz
3200MHz
3200MHz
3200MHz
3600MHz
3600MHz
Data Transfer Bandwidth
25,600 MB/s (PC4 25600)
25,600 MB/s (PC4 25600)
25,600 MB/s (PC4 25600)
25,600 MB/s (PC4 25600)
28,800 MB/s (PC4 28800)
28,800 MB/s (PC4 28800)
Latency
CL16-18-18-38
CL16-18-18-38
CL16-18-18-38
CL16-18-18-38
CL18-22-22-42
CL18-22-22-42
Voltage
1.35V
1.35V
1.35V
1.35V
1.35V
1.35V
Dimensions
43.5(H) x 141(L) x 8.3(W)mm
43.5(H) x 141(L) x 8.3(W)mm
43.5(H) x 141(L) x 8.3(W)mm
43.5(H) x 141(L) x 8.3(W)mm
43.5(H) x 141(L) x 8.3(W)mm
43.5(H) x 141(L) x 8.3(W)mm
Heat Spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader
Aluminum heat spreader